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On May 24, 2013, leaders from Harbin University of Commerce attended the Shangyang Packaging Printing Scholarship and Yang Jiping Packaging·Printing Stipend awarding ceremony 2011-2012 held by Shangyang Packaging. Scholarship and stipend awarded by Shangyang Packaging for the second time suggest that we not only place a high level of importance on talent development, but also regard the event an important part in our course of development.
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